6. Processing and Characterization

Joining Methods — Quiz

Test your understanding of joining methods with 5 practice questions.

Practice Questions

Question 1

Which non-fusion joining method is most effective at accommodating differences in coefficients of thermal expansion between two dissimilar substrates?

Question 2

A steel plate with thermal diffusivity $\alpha=1.2\times10^{-5}\,\mathrm{m^2/s}$ is subjected to a weld arc for $t=3\,\mathrm{s}$. Using the approximation $\delta=\sqrt{\alpha t}$, what is the approximate half-width of the heat-affected zone in millimetres?

Question 3

In brazing stainless steel at 900\,$^\circ$C using a filler metal with melting point 800\,$^\circ$C, which metallurgical issue is most likely to degrade the mechanical properties of the base metal?

Question 4

In gas tungsten arc welding (GTAW), increasing the diameter of the tungsten electrode primarily results in which effect?

Question 5

In electronic solder joints between Sn–Ag–Cu solder and a copper substrate, which intermetallic compound is most commonly responsible for joint embrittlement when it thickens?